Touch sensor and method for manufacturing same

ABSTRACT

The present application relates to a touch sensor and a method of manufacturing the same, and the touch sensor according to the present application includes: a substrate; and a driving electrode unit, a sensing electrode unit, and a wiring electrode unit provided on the same surface of the substrate, in which each of the driving electrode unit, the sensing electrode unit, and the wiring electrode unit includes a conductive pattern including a shielding portion and an opening portion.

TECHNICAL FIELD

This application is a National Stage Application of InternationalApplication No. PCT/KR2016/006303 filed on Jun. 14, 2016, which claimspriority to and the benefit of Korean Patent Application No.10-2015-0083803 filed in the Korean Intellectual Property Office on Jun.14, 2015, both of which are incorporated herein in their entirety byreference for all purposes as if fully set forth herein.

The present application relates to a touch sensor and a method ofmanufacturing the same.

BACKGROUND ART

In general, a display device refers to monitors for a TV or a computeras a whole, and includes a display element forming an image and a casesupporting the display element.

Examples of the display element may include a plasma display panel(PDP), a liquid crystal display (LCD), an electrophoretic display, and acathode-ray tube (CRT). The display element may include an RGB pixelpattern and an additional optical filter for implementing an image.

The optical filter may include at least one of a reflection preventionfilm preventing the external light that is incident from the outsidefrom being reflected to the outside again, a near IR shielding filmshielding the near IR generated in the display element in order toprevent a mis-operation of electronic devices such as remotecontrollers, a color correction film increasing the color purity bycontrolling a color tone by including a color control dye, and anelectromagnetic wave shielding film that shields the electromagneticwave generated in a display element when a display apparatus is driven.Here, the electromagnetic wave shielding film includes a transparentsubstrate and a metal mesh pattern provided on the substrate.

Meanwhile, with regard to the display apparatus, as the distribution ofIPTVs is accelerated, a demand for a touch function that uses hands as adirect input apparatus without a separate input apparatus such as remotecontrollers is growing. Further, a multi-touch function that is capableof recognizing a specific point and writing is also required.

The touch sensor performing the aforementioned function may beclassified into the following types according to a signal detectionmanner.

That is, the touch sensor includes a resistive type, in which a positionpressed by pressure in a state where a direct-current voltage is appliedis sensed based on a change in a current or voltage value, a capacitivetype using capacitance coupling in a state where an alternating-currentvoltage is applied, an electromagnetic type, in which a selectedposition is sensed based on a change in a voltage in a state where amagnetic field is applied, and the like.

Among them, the resistive type and capacitive type touch sensors thatare most extensively spread recognize a touch by a change in an electriccontact or capacitance by using a transparent conductive film, such asan ITO film. However, since the transparent conductive film has highresistance of 100 ohm/square or more, sensitivity is degraded when thetransparent conductive film is manufactured in a large scale, and as thesize of screen is increased, the cost of the ITO film is rapidlyincreased, so that it is not easy to commercialize the touch sensor. Inorder to overcome the problem, there is an effort to implement atransparent conductive film by using a metal pattern having highconductivity.

DETAILED DESCRIPTION OF THE INVENTION Technical Problem

The present application aims to improve a manufacturing process of atouch sensor to decrease manufacturing cost of the touch sensor, andimprove lightness and thinness of the touch sensor.

Technical Solution

An exemplary embodiment of the present specification provides a touchsensor, including: a substrate; and a driving electrode unit, a sensingelectrode unit, and a wiring electrode unit provided on the same surfaceof the substrate, in which the touch sensor includes a touch sensingregion and a touch non-sensing region, each of the driving electrodeunit, the sensing electrode unit, and the wiring electrode unit includesa conductive pattern including a shielding portion and an openingportion, the wiring electrode unit includes a first wiring electrodeunit positioned in the touch sensing region of the touch sensor and asecond wiring electrode unit positioned in the touch non-sensing regionof the touch sensor, and the conductive pattern configuring the touchsensing region includes a form, in which n repeated unit patterns arerepeated in a width direction of the touch sensing region.

Another exemplary embodiment of the present application provides adisplay device including the touch sensor.

Advantageous Effects

According to the exemplary embodiment of the present application, it ispossible to provide the touch sensor in a single surface one-sheet type,so that it is possible to minimize a thickness of the touch sensor, andall of the conductive patterns are formed on the single surface, so thatthe manufacturing method is easy. Further, the touch sensor is in theone sheet type, so that the present application has an advantage in thatthe lamination is not required compared to the related art in which thetouch sensor is formed by using two or more sheets of substrates.Further, the sensing electrode unit and the driving electrode unit arepresent on the same surface, so that it is easy to install and attach aflexible printed circuit board (FPCB). Further, the touch sensor is inthe one sheet type, so that light transmittance is excellent compared tothe touch sensor in the two sheet type. Further, when a functionalsurface film is laminated on the surface of the touch sensor, a step isnot large, so that there is an advantage in that bubbles are notgenerated.

According to one particular example of the present application, it ispossible to improve a manufacturing process of a touch sensor todecrease manufacturing cost of the touch sensor, and improve lightnessand thinness of the touch sensor.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 to 3 are diagrams schematically illustrating a touch sensor inthe related art.

FIG. 4 is a diagram schematically illustrating a wiring electrode unitof the touch sensor in the related art.

FIGS. 5 to 10 are diagrams schematically illustrating a touch sensoraccording to an exemplary embodiment of the present application.

BEST MODE

Hereinafter, the present application will be described in detail.

In a case of an existing touch sensor, a product, in which a drivingelectrode pattern (Tx pattern) serving to drive as a voltage and asensing electrode pattern (Rx pattern) which receives a signal of mutualcapacitance with respect to the driving electrode pattern and transmitsthe received signal to a circuit are formed on separate substrates,respectively, or a driving electrode pattern and a sensing electrodepattern are formed on both surfaces of a substrate, respectively, thatis, a product, in which a driving electrode pattern and a sensingelectrode pattern are spatially separated, is a mainstream. A design andmanufacturing of a touch sensor in consideration of a layer structureand a dielectric constant of a dielectric substance interposed in thelayer structure in order to maximize touch sensitivity and a value ofcapacitance are accepted as core technologies. However, in theaforementioned method, the cost of the sensor is a continuous issue inan aspect that an optically clear adhesive (OCA) corresponding to thedielectric substance and two sheets of an indium tin oxide (ITO) filmused as transparent electrodes are used, and in order to solve the costissue, a technology for designing and manufacturing a touch sensor withone single surface layer, in which a driving electrode pattern (Txpattern) and a sensing electrode pattern (Rx pattern) are present in onesurface, is newly on the rise.

The touch sensor with the one single surface layer may be generallydivided into a touch sensor by a method using self capacitance, a touchsensor by a method using mutual capacitance, and a touch sensor by anFxy method using a metal bridge and the like. However, it is true thateach of the method using the self capacitance and the method using themetal bridge cannot give large attract due to a performance issue (in acase of a self-capacitance, a ghost phenomenon and a limit of amulti-touch), an issue of yield between manufacturing processes, and thelike.

Other than the two foregoing methods, the touch sensor by the methodusing mutual capacitance recently gets the large spotlight, and thereason is that the method using mutual capacitance has a main point thata region, in which capacitance is formed, is formed in a plane in thesame space, so that there are an issue, such as sensitivity, and anissue of pattern manufacturing in an aspect that a wiring region isformed in a screen part, but the method using mutual capacitance has themost excellent characteristic in a performance aspect compared to othermethods. Accordingly, active development for implementing the methodusing mutual capacitance in the ITO is conducted. However, the methodusing mutual capacitance also has an issue of resistance by a use of amaterial that is the ITO having relatively high resistance, such that itis true that applicability is limited to 5 inches or less.

In order to solve the problems, the present application presents a touchsensor with one single surface layer which uses a conductive metal lineas a driving electrode pattern and a sensing electrode pattern.

A touch sensor with one single surface layer using an ITO electrode inthe related art is schematically illustrated in FIGS. 1 and 2 below.Further, a driving electrode pattern and a sensing electrode pattern ofthe touch sensor with one single surface layer using an ITO electrode inthe related art are illustrated in FIG. 3 below in more detail.

FIG. 3 illustrates a sensing electrode pattern (Rx pattern) and adriving electrode pattern (Tx pattern) that is an X-shaped pattern. Thatis, the sensing electrode pattern (Rx pattern) is designed to have alarger area than that of the driving electrode pattern (Tx pattern), anda signal is applied through a common electrode. In the meantime, thedriving electrode pattern (Tx pattern) is implemented in an X-shapedpattern, and a wiring unit is formed through a dead zone for applying asignal to each of the driving electrode patterns (Tx patterns).

It is most preferable to minimize the dead zone according to the regionof the wiring unit in terms of touch resolution, and to this end, it isnecessary to appropriately adjust a width of a conductive metal lineand/or a space of the dead zone. In this case, when the width of thespace is equal to or larger than a predetermined numerical value, thepattern may be considered as a pattern advantageous in terms ofinterference of mutual signals. Further, in order to secureconductivity, the width of the conductive metal line needs to be large,and a smaller width of the space is advantageous to secure conductivity.Accordingly, it is preferable to appropriately adjust the width of theconductive metal line and/or the space of the dead zone.

Further, a portion other than the sensing electrode pattern, the drivingelectrode pattern, and the dead zone in FIG. 3 is an area correspondingto an area, in which a dummy electrode or a pattern is not formed, andmay be an area which does not exert a large influence on substantialelectrical connectivity.

In the present application, particular contents for configuring thedriving electrode pattern and the sensing electrode pattern of the touchsensor with the one single surface layer with conductive metal lines areprovided below.

In a case of a general ITO pattern, a concept of a line and a space isintroduced to the forming of a wiring unit, so that it is general toform a wiring pattern having a form illustrated in FIG. 4. Accordingly,the present application introduces a design minimizing a space forsecuring connectivity of conductive metal lines and improving yield.

A touch sensor according to an exemplary embodiment of the presentapplication includes: a substrate; and a driving electrode unit, asensing electrode unit, and a wiring electrode unit provided on the samesurface of the substrate, and the touch sensor includes a touch sensingregion and a touch non-sensing region, each of the driving electrodeunit, the sensing electrode unit, and the wiring electrode unit includesa conductive pattern including a shielding portion and an openingportion, the wiring electrode unit includes a first wiring electrodeunit positioned in the touch sensing region of the touch sensor and asecond wiring electrode unit positioned in the touch non-sensing regionof the touch sensor, and the conductive pattern configuring the touchsensing region includes a form, in which n repeat unit patterns arerepeated in a width direction of the touch sensing region.

In the present application, n may be an integer of 2 to 100, but is notlimited thereto.

In the present application, each of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit includes aconductive pattern including a shielding portion and an opening portion.The shielding portion means a region, in which a material, for example,a conductive metal line, configuring conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit, is provided, on the substrate, and the opening portion means aregion, in which the conductive metal line is not provided, on thesubstrate. That is, the shielding portion may mean an opticallynon-transparent region, and for example, transmittance of the shieldingportion may be 20% or less, and may be 10% or less.

In the present application, as the mesh pattern, a pattern shape, suchas a mesh pattern, known in the art may be used. The mesh pattern mayinclude a polygonal pattern including one or more shapes of a triangle,a quadrangle, a pentagon, a hexagon, and an octagon.

In the present application, the repeat unit pattern may include aconductive pattern of the driving electrode unit, a conductive patternof the sensing electrode unit, and a conductive pattern of the firstwiring electrode unit.

In the present application, a width D of the repeat unit pattern may beexpressed with Equation 1 below.D=A/(n×m)  [Equation 1]

In Equation 1, A is a width of the touch sensing region, n is the numberof repeat unit patterns, and m is a divisor of n.

The touch sensor according to the exemplary embodiment of the presentapplication is schematically illustrated in FIG. 5.

As illustrated in FIG. 5, according to the present application, therepeat unit patterns may be periodically provided in a horizontaldirection (width direction) of the touch sensing region. In the presentspecification, the horizontal direction of the touch sensing region willbe called an x-axis direction, and a vertical direction of the touchsensing region will be called a y-axis direction.

The touch sensor according to the exemplary embodiment of the presentapplication is schematically illustrated in FIGS. 6 and 7.

As illustrated in FIG. 6, in the present application, it is assumed thata vertical distal end of any one of the repeat unit patterns is “S”, anda vertical distal end of another repeat unit pattern is “S1”.

As illustrated in FIGS. 6 and 7, when a virtual line simultaneouslybisecting respective sides, in which disconnection points arepositioned, is drawn in polygons including disconnection lines around Sand S1 inside the repeat unit pattern, shapes of the patterns of S andS1 may be the same as each other, and patterns of closed figures of Sand S1 formed of the disconnection line may be the same as each other,which results from the periodicity of the repeat unit pattern. In thiscase, the disconnection point may be divided into a case including thecrossing point of the polygonal mesh pattern or a case including nocrossing point of the polygonal mesh pattern.

The touch sensor according to the exemplary embodiment of the presentapplication is schematically illustrated in FIGS. 8 and 9.

In the present application, when the case where the disconnection pointdoes not include the crossing point of the polygonal mesh pattern isconsidered, a position of the disconnection point may be allowed withany disconnection line form when an entire shape of the closed figureincluding the disconnection line is not changed. The regularity may beallowed to a structure of the touch sensor including various polygonalmesh patterns. However, when convenience in designing a touch sensor isconsidered, a case where the disconnection points are positioned at thesame position in S and S1 based on the virtual line simultaneouslybisecting the respective sides including the disconnection lines withinthe closed figures including the disconnection lines around S and S1 maybe the most reasonable in terms of repetitiveness of the design andconvenience according to the repetitiveness of the design.

The touch sensor according to the exemplary embodiment of the presentapplication is schematically illustrated in FIG. 10.

In the present application, the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit are formed of regular polygonal mesh patterns, and the repeat unitpattern may satisfy Equation 5 below.0<A _(s) +A _(s1)<2A _(L)  [Equation 5]

In Equation 5, A_(s) means an area of one first polygon which isprovided within the repeat unit pattern and includes any one verticaldistal end of the repeat unit pattern, A_(s1) means an area of onesecond polygon which is provided within the repeat unit pattern andincludes another vertical distal end of the repeat unit pattern, A_(L)means an area of the one regular polygon, and the first polygon and thesecond polygon are provided so as to share the same horizontal axis ofthe repeat unit pattern.

Further, the repeat unit pattern may satisfy Equation 6 below.0<A _(s) +A _(s1) =A _(L)  [Equation 6]

In the present application, the first wiring electrode unit includes oneor two or more bundles of the wires connecting the driving electrodeunit or the sensing electrode unit to the second wiring electrode unit,and each of the wires is formed of a mesh pattern, and in the bundleincluding the maximum number of wires among the bundles, a width W ofthe bundle, the number n2 of wires included in the bundle, and a minimumvalue P among distances between center points of adjacent meshstructures sharing at least one side among the mesh patterns forming thewires may satisfy Equation 2 below.

$\begin{matrix}{{\frac{W}{n\; 2} \times \sqrt{2}} \geq P} & \lbrack {{Equation}\mspace{14mu} 2} \rbrack\end{matrix}$

In the present application, the distance between the center points ofthe adjacent mesh structures sharing at least one side among the meshpatterns forming the wires may correspond to a pitch of a mesh patternwhen the mesh pattern is a regular mesh pattern, and may correspond to adistance between center points of the adjacent polygonal patternssharing at least one side or a distance between center points of gravitywhen the mesh pattern includes a polygonal pattern including variousforms.

In the exemplary embodiment of the present application, Equation 2 maybe expressed with Equation 3 below.

$\begin{matrix}{\frac{W}{n\; 2} \geq {P \times \cos\;\theta\; 1}} & \lbrack {{Equation}\mspace{14mu} 3} \rbrack\end{matrix}$

In Equation 3, W, n2, and P are the same as those defined in Equation 2,and θ1 represents a small value among the angles between a straight linecontinuing in a width direction of the bundle with the shortest distanceand straight lines connecting center points of the adjacent meshstructures sharing at least one side with the shortest distance.

In the exemplary embodiment of the present application, a touch sensingregion of the touch sensor may include a driving electrode unit, asensing electrode unit, and a first wiring electrode unit. Further, thetouch non-sensing region of the touch sensor may include a second wiringelectrode unit. In the present application, the touch sensing region mayalso be expressed with a term, such as a touch sensitive region, a touchpermittable region, and a touch activation region.

In the present application, the bundle is formed in a pattern shape, inwhich a closed figure having two disconnection points is continuouslydisposed in a direction from one side of the substrate adjacent to anend of the second wiring electrode to the other side of the substratefacing the one side, and a virtual straight line connecting the adjacentdisconnection points of the continuously disposed closed figures withthe shortest distance has one or more inflection points, an angle formedby the virtual straight line at the inflection point is 90° or more, anda pattern that is in contact with the virtual straight line mayelectrically connect the driving electrode unit or the sensing electrodeunit to the second wiring electrode unit.

In the present application, the disconnection point means a region inwhich a part of a boundary pattern of the closed figure is disconnectedto cut an electrical connection of the boundary pattern, and may beexpressed with a term, such as a disconnection point and a disconnectionpart. That is, when the wiring electrode unit includes a pattern formedof a conductive metal line, the pattern may include two or more metallines spaced apart from each other in a longitudinal direction of theconductive metal line by the disconnection point.

In this case, as a result of an evaluation of moiré for the conductivepattern after a line width of a conductive pattern of the wiringelectrode unit is split with various line widths to manufacture theconductive pattern, it was confirmed that when an average diameter ofthe disconnection point or a width of the disconnection part is within13 μm, moiré by the wiring electrode unit is not generated while fullybonding the wiring electrode unit to a display, and it was confirmedthat a case where an average diameter of the disconnection point or awidth of the disconnection part is 7 μm or less is most advantageous.

In the present application, the average diameter of the disconnectionpoint or the width of the disconnection part may mean a distance betweenclosest distal ends of the two or more spaced conductive metal lines.The distance between the closest distal ends of the two or more spacedconductive metal lines means a distance between the distal ends whichare most adjacent to each other in the two or more conductive metallines which are spaced apart from each other.

In the exemplary embodiment of the present application, Equation 2 maybe expressed with Equation 4 below.

$\begin{matrix}{\frac{W}{n\; 2} \geq {P \times \cos\;{\theta 2}}} & \lbrack {{Equation}\mspace{14mu} 4} \rbrack\end{matrix}$

In Equation 4, W, n2, and P are the same as those defined in Equation 2,and θ2 represents a small value among the angles between a straight linein a vertical direction with respect to a virtual straight lineconnecting the disconnection points with the shortest distance, and astraight line connecting the center points of the adjacent meshstructures sharing at least one side with the shortest distance.

In the exemplary embodiment of the present application, a part, whichhas the longest distance between the inflection points, in the virtualstraight line may be parallel to at least one side configuring theclosed figure or may form an angle more than 0° and less than 90°.

In the exemplary embodiment of the present application, at least a partof the conductive patterns of the driving electrode unit and the sensingelectrode unit may additionally include the aforementioned disconnectionpoint or disconnection part. In this case, an average diameter of thedisconnection point or a width of the disconnection part may be 13 μm orless, may be 10 μm or less, and may be 7 μm or less, but is not limitedthereto.

In the present application, when it is assumed that a width of thebundle is “W”, based on an area of W×W, an opening ratio deviationbetween predetermined regions of the touch sensor corresponding to thearea of W×W may be 10% or less, may be 5% or less, and may be 3% orless, but is not limited thereto. The predetermined regions of the touchsensor may include a region inside the driving electrode unit, a regioninside the sensing electrode unit, a region inside the wiring electrodeunit, a combined region of the driving electrode unit and the sensingelectrode unit, a combined region of the driving electrode unit and thewiring electrode unit, and a combined region of the sensing electrodeunit and the wiring electrode unit.

In the exemplary embodiment of the present application, the drivingelectrode unit and the sensing electrode unit may be formed of theconductive metal line, and the disconnection point or the disconnectionpart may be provided in a crossing point region, in which the conductivemetal lines within the driving electrode unit or the sensing electrodeunit cross each other, but the present application is not limitedthereto. When the disconnection point is provided in the crossing pointregion, in which the conductive metal lines within the driving electrodeunit or the sensing electrode unit cross each other, a diameter of thedisconnection point may be 40 μm or less and may be 20 μm or less interms of a moiré characteristic and visibility and the like, but is notlimited thereto.

Further, an electrically isolated conductive metal line may beadditionally provided within a predetermined distance based on a centerof the disconnection point or the disconnection part. A length of theelectrically isolated conductive metal line is not particularly limited,and may be within a deviation of 10% with the average diameter of thedisconnection point or the width of the disconnection part. Further, theelectrically isolated conductive metal line may also be provided to beparallel to the disconnection point or the disconnection part, and mayalso be vertical to the disconnection point or the disconnection part orirregularly provided. Further, the electrically isolated conductivemetal line may have an area of 80% to 120% of a multiplication of theaverage diameter of the disconnection point or the width of thedisconnection part and a line width of the conductive metal line.Further, a distance between a distal end of the electrically isolatedconductive metal line and a distal end of a conductive metal lineadjacent to the distal end of the electrically isolated conductive metalline may be 13 μm or less. A size, a form, a length, and the like of theelectrically isolated conductive metal line may be appropriatelyadjusted so that a deviation of an opening ratio between thepredetermined regions of the touch sensor is within 10%.

An important point together with the hiding of the conductive patternmay be a minimization of the dead zone within the wiring electrode unitas mentioned above.

In the present application, in order to confirm a design for minimizingthe dead zone, a pitch and an angle of the conductive metal line patternof the wiring electrode unit were observed by changing the pitch and theangle of the conductive metal line pattern of the wiring electrode unitwhile fixing a width of the bundle of the wiring electrode unit.

As a result, in a case where the conductive pattern configuring thewiring electrode unit is a mesh pattern and the mesh pattern is a squareshape, when it is assumed that a width of the bundle is “W”, a pitch ofthe mesh pattern is “P”, and the number of wires included in the bundleis “n”, it could be seen that when the relation of Equation 1 issatisfied, a width of the bundle is formed regardless of the change inan angle of the mesh pattern.

In this case, it could be seen that there is no big difficulty to formthe wiring electrode unit even when directionality of the disconnectionline for forming the wiring electrode unit is not straight, and it couldbe seen that a case where a moiré avoidance angle is 45° which is thebest case is advantageous in every case.

Herein, the directionality of the disconnection line means a directionof a line displayed when the adjacent disconnection points ordisconnection parts are connected with the shortest distance. Even whenthe directionality of the disconnection line for forming the wiringelectrode unit is not straight, for example, a zigzag line and acombination of a straight line and a zigzag line, it is possible to seta direction of a flow of a current similar to that of a case where thedirectionality of the disconnection line is straight through anappropriate design of a position of the disconnection line.

Further, the touch sensor according to the present application mayrecognize a touch input by using a mutual capacitance method.Particularly, the touch sensor according to the present application aimsfor an electrical disconnection between the driving electrode unit andthe sensing electrode unit by using the disconnection point or thedisconnection part, a dummy pattern, and the like without inserting aseparate insulating material between the driving electrode unit and thesensing electrode unit, and is different from a touch sensor using ametal bridge, an insulating layer, and the like in the related art.

In the present application, each of the conductive patterns of thedriving electrode unit, the sensing electrode unit, and the wiringelectrode unit may also be formed by an independent printing process,and the conductive patterns of the driving electrode unit, the sensingelectrode unit, and the wiring electrode unit may also be simultaneouslyformed by a one-time printing process.

Accordingly, the conductive patterns of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit may have the sameline height.

Further, at least a part of the conductive patterns of the drivingelectrode unit and the wiring electrode unit includes a connectionregion, and the connection region may have no joint. Further, at least apart of the conductive patterns of the sensing electrode unit and thewiring electrode unit includes a connection region, and the connectionregion may have no joint.

In the present application, no joint means that there is no artificiallyconnected trace in the physically connected conductive pattern.Typically, pattern forms and sizes of a touch unit and a wiring unit aredifferent and thus the touch unit and the wiring unit are formed bydifferent methods in the related art, so that a joint is inevitablyformed in a portion in which the patterns of the touch unit and thewiring unit are connected. However, in the present application, it ispossible to form a touch unit, a wiring unit, and the like by using oneprocess, so that the present application may have a characteristic thatthere is no joint and line heights of the patterns of the touch unit,the wiring unit, and the like are the same.

In the present application, the same line height means that a standarddeviation of a line height is less than 10%, preferably, less than 5%,or more preferably, less than 2%.

In the present application, the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit are provided on the substrate, and all of the conductive patternsof the driving electrode unit, the sensing electrode unit, and thewiring electrode unit may be provided on the same surface of thesubstrate.

A high hardness hard coating layer may be additionally included in atleast one surface of the substrate. In this case, the high hardness hardcoating layer is provided on any one surface of the substrate, and theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit may be provided on the other surfaceof the substrate, but the present application is not limited thereto.Further, the conductive patterns of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit may be provided onthe high hardness hard coating layer, but the present application is notlimited thereto.

The high hardness hard coating layer may include: a monomer for a binderincluding 3 to 6-functional acrylate-based monomers; inorganicparticles; a photoinitiator; and an organic solvent, and be formed byusing a hard coating composition, in which, for a solid including themonomer for the binder, the inorganic particles, and the photoinitiator,a weight ratio of the solid:the organic solvent is 70:30 to 99:1.

Further, the high hardness hard coating layer may be formed by using ahard coating composition in a solvent free form including: a monomer fora binder including 3 to 6-functional acrylate-based monomers; inorganicparticles; and a photoinitiator.

Particular contents of the hard coating composition are provided below.

The term “acrylate-based” means all of methacrylate or the derivativesin which a substituent is introduced to acrylate or methacrylate, aswell as acrylate.

The 3 to 6-functional acrylate-based monomers may include trimethylolpropane triacrylate (TMPTA), trimethylol propane ethoxy triacrylate(TMPEOTA), glycerine propoxylated triacrylate (GPTA), pentaerythritoltetra acrylate (PETA), or dipentaerythritol hexa acrylate (DPHA). The 3to 6-functional acrylate-based monomers may be solely used or may becombined with different types and used.

According to the exemplary embodiment of the present invention, themonomer for the binder may further include 1 to 2-functionalacrylate-based monomers.

The 1 to 2-functional acrylate-based monomers may include, for example,hydroxyl ethylacrylate (HEA), hydroxylethyl methacrylate (HEMA),hexandiol diacrylate (HDDA), tripropyleneglycol diacrylate (TPGDA), orethylene glycol diacrylate (EGDA). The 1 to 2-functional acrylate-basedmonomers may be solely used or may be combined with different types andused.

According to the exemplary embodiment of the present invention, themonomer for the binder may be included with about 35 to about 85 partsby weight or about 45 to about 80 parts by weight with respect to 100parts by weight of the solid including the monomer for the binder, theinorganic particles, and the photoinitiator. When the monomer for thebinder has the foregoing range, a hard coating film which exhibits highhardness and excellent processibility and has little curl or crackgeneration may be formed.

Further, when the monomer for the binder additionally includes the 1 to2-functional acrylate-based monomers, a content ratio of the 1 to2-functional acrylate-based monomers and the 3 to 6-functionalacrylate-based monomers is not particularly limited, but according tothe exemplary embodiment of the present invention, the 1 to 2-functionalacrylate-based monomers and the 3 to 6-functional acrylate-basedmonomers may be included so as to have a weight ratio of about 1:99 toabout 50:50, about 10:90 to about 50:50, or about 20:80 to about 40:60.When the 1 to 2-functional acrylate-based monomers and the 3 to6-functional acrylate-based monomers are included with the weight ratio,it is possible to assign high hardness and flexibility without adegradation of a curl characteristic or other properties, such as lightresistance.

According to another exemplary embodiment of the present application,the monomer for the binder may further include a photocurable elasticpolymer.

Throughout the present specification, the photocurable elastic polymermeans a polymer material which includes a functional group which may bepolymerized by radiation of ultraviolet rays and exhibits elasticity.

According to the exemplary embodiment of the present application, thephotocurable elastic polymer may have elongation of about 15% or more,for example, about 15 to about 200%, about 20 to about 200%, or about 20to about 150% when being measured by the ASTM D638.

When the hard coating composition of the present application furtherincludes the photocurable elastic polymer, the photocurable elasticpolymer is cross-linked and polymerized with the 3 to 6 functionalacrylate-based monomer to form a hard coating layer after hardening, andmay assign flexibility and impact resistance to the formed hard coatinglayer.

When the monomer for the binder further includes the photocurableelastic copolymer, a content ratio of the photocurable elastic copolymerand the 3 to 6 functional acrylate-based monomer is not speciallylimited, but according to the exemplary embodiment of the presentinvention, the photocurable elastic copolymer and the 3 to 6 functionalacrylate-based monomer may be included to have a weight ratio of about5:95 to about 20:80. When the to 6 functional acrylate-based monomer andthe photocurable elastic polymer are included with the foregoing weightratio, it is possible to assign high hardness and flexibility to thehard coating layer without a degradation of a curl characteristic orother properties, such as light resistance, and particularly, it ispossible to prevent the hard coating layer from being damaged byexternal impact to secure excellent impact resistance.

According to the exemplary embodiment of the present application, thephotocurable elastic polymer may be a polymer or an oligomer of whichweight-average molecule weight is in a range of about 1,000 to about600,000 g/mol or about 10,000 to about 600,000 g/mol.

For example, the photocurable elastic polymer may be one or more kindsselected from the group consisting of polycaprolactone, a urethaneacrylate-based polymer, and polyrotaxane.

Polycaprolactone among the materials usable as the photocurable elasticpolymer is formed by ring opening polymerization of caprolactone, andhas an excellent property, such as flexibility, impact resistance anddurability.

The urethane acrylate-based polymer includes a urethane bond and has acharacteristic of excellent elasticity and durability.

The polyrotaxane means a compound in which a dumbbell shaped moleculeand a cyclic compound (macrocycle) are structurally fitted. The dumbbellshaped molecule includes a uniform linear molecule and blocking groupsdisposed at both distal ends of the linear molecule, and the linearmolecule passes through an internal side of the cyclic compound, and thecyclic compound may move along the linear molecule, and is preventedfrom being separated by the blocking group.

According to the exemplary embodiment of the present application, thehard coating composition may include a rotaxane compound including: acyclic compound combined with a lactone-based compound in which a(meta)acrylate-based compound is introduced to a distal end; a linearmolecule passing through the cyclic compound; and blocking groupsdisposed at both distal ends of the linear molecule to prevent thecyclic compound from being separated.

In this case, when the cyclic compound has a size enough to pass throughor surround the linear molecule, the cyclic compound may be used with aparticular limit, and may also include a functional group, such as ahydroxyl group, an amino group, a carboxyl group, a thiol group, or analdehyde group, which may react with other polymers or compounds.Particular examples of the cyclic compound may include α-cyclodextrin,β-cyclodextrin, γ-cyclodextrin, or a mixture thereof.

Further, a compound which has predetermined molecule weight or more andhas a straight chain form may be used as the linear molecule without alarge limit, and a polyalkylene-based compound or a polylactone-basedcompound may be used. Particularly, a polyoxyalkylene-based compoundincluding an oxyalkylene repeat unit of carbon numbers 1 to 8 or apolylactone-based compound having a lactone-based repeat unit of carbonnumbers 3 to 10 may be used.

In the meantime, the blocking group may be appropriately adjustedaccording to a characteristic of the prepared rotaxane compound, and forexample, one kind or two or more kinds selected from the groupconsisting of a dinitrophenyl group, a cyclodextrin group, an adamantanegroup, a trityl group, a fluorescein group, and a pyrene group may beused.

The polyrotaxane compound has excellent scratch resistance, so that whena scratch or external damage is generated, the hard coating layer mayexhibit autogenous healing performance.

The hard coating composition of the present application includesinorganic particles. In this case, the inorganic particles may beincluded in a form dispersed in the monomer for the binder.

According to the exemplary embodiment of the present application,inorganic particles having a nano scale grain size, for example, nanoparticles having a grain size of about 100 nm or less, about 10 to about100 nm, or about 10 to about 50 nm may be used as the inorganicparticles. Further, for example, silica particles, aluminum oxideparticles, titanium oxide particles, or zinc oxide particles may be usedas the inorganic particles.

The hard coating composition includes the inorganic particles, so thatit is possible to further improve hardness of the hard coating film.

According to the exemplary embodiment of the present application, theinorganic particles may be included with about 10 to about 60 parts byweight or about 20 to about 50 parts by weight with respect to 100 partsby weight of the solid including the monomer for the binder, theinorganic particles, and the photoinitiator. The hard coatingcomposition includes the inorganic particles with the foregoing range,so that it is possible to achieve an effect of the improvement ofhardness of the hard coating film according to the addition of theinorganic particles within the range in which a property is notdegraded.

The hard coating composition of the present application includes aphotoinitiator.

According to the exemplary embodiment of the present application, thephotoinitiator may include 1-hydroxy-cyclohexyl-phenyl ketone,2-hydroxy-2-methyl-1-phenyl-1-propanone,2-hydroxy-1-[4-(2-hydroxyetoxy)phenyl]-2-methyl-1-propanone, methylbenzoylformate, α,α-dimethoxy-α-phenylacetophenone,2-benzoil-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone,2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propanonediphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide, orbis(2,4,6-trimethylbenzoyl)-phenylphoshine oxide, but is not limitedthereto. Further, a product currently on the market as thephotoinitiator includes Irgacure 184, Irgacure 500, Irgacure 651,Irgacure 369, Irgacure 907, Darocur 1173, Darocur MBF, Irgacure 819,Darocur TPO, Irgacure 907, Esacure KIP 100F, and the like. Thephotoinitiators may be separately used or two or more different types ofphotoinitiators may be mixed and used.

According to the exemplary embodiment of the present invention, thephotoinitiator may be included with about 0.5 to about 10 parts byweight or about 1 to about 5 parts by weight with respect to 100 partsby weight of the solid including the monomer for the binder, theinorganic particles, and the photoinitiator. When the photoinitiator iswithin the foregoing range, it is possible to achieve sufficientcross-linking photopolymerization without degrading a property of thehard coating film.

In the meantime, the hard coating composition of the present applicationmay additionally include an addition agent, such as a surfactant, ayellowing preventing agent, a leveling agent, and an antifouling agent,typically used in the art to which the present application belongs, inaddition to the foregoing monomer for the binder, inorganic particles,and photoinitiator. Further, the content of the adhesive is variouslyadjustable within a range, in which a property of the hard coatingcomposition of the present application is not degraded, so that thecontent of the adhesive is not specially limited, but the adhesive maybe included with, for example, about 0.1 to about 10 parts by weightwith respect to 100 parts by weight of the solid.

According to the exemplary embodiment of the present application, forexample, the hard coating composition may include a surfactant as anaddition agent, and the surfactant may be a fluoro-based acrylate of 1to 2 functionality, a fluoro-based surfactant, or a silicon-basedsurfactant. In this case, the surfactant may be included in a formdispersed or cross-linked within the crosslinked copolymer.

Further, the hard coating composition may include a yellowing preventingagent as the addition agent, and the yellowing preventing agent mayinclude a benzophenone-based compound or a benzotriazol-based compound.

The hard coating composition of the present application includes anorganic solvent.

In the hard coating composition according to the exemplary embodiment ofthe present application, the organic solvent may be included within arange of a weight ratio of the solid:the organic solvent which is about70:30 to about 99:1 with respect to the solid including the monomer forthe binder, the inorganic particles, and the photoinitiator. The hardcoating composition of the present invention includes the solid with ahigh content as described above to obtain a composition with highviscosity, and thus thick coating is available, so that it is possibleto form the hard coating layer having a high thickness, for example, 50μm or more.

According to the exemplary embodiment of the present application, analcohol-based solvent, such as methanol, ethanol, isopropyl alcohol, andbutanol, an alkoxy alcohol-based solvent, such as 2-methoxyethanol,2-ethoxyethanol, and 1-methoxy-2-propanol, a ketone-based solvent, suchas acetone, methyl ethyl ketone, methylisobutylketone,methylpropylketone, and cyclohexanon, an ether-based solvent, such aspropyleneglycolmonopropylether, propyleneglycolmonomethylether,ethyleneglycolmonoethylether, ethyleneglycolmonopropylether,ethyleneglycolmonobutylether, diethyleneglycolmonomethylether,diethylglycolmonoethylether, diethylglycolmonopropylether,diethylglycolmonobutylether, diethyleneglycol-2-ethylhexylether, anaromatic solvent, such as benzene, toluene, and xylene, and the like maybe solely used or may be mixed and used as the organic solvent.

According to the exemplary embodiment of the present application, whenviscosity of the hard coating composition is within a range havingappropriate fluidity and coating performance, the viscosity of the hardcoating composition is not particularly limited, but the hard costingcomposition has a relatively high content of the solid, therebyexhibiting high viscosity. For example, the hard coating composition ofthe present invention may have viscosity of about 100 to 1,200 cps,about 150 to 1,200 cps, or about 300 to 1,200 cps at a temperature of25° C.

The solvent type or solvent-free type hard coating composition of thepresent invention including the foregoing ingredients is applied onto asupport substrate and then is photocured to form a hard coating layer.

In a hard coating film to be used as a cover of a mobile communicationterminal or a tablet PC, it is important to improve hardness of the hardcoating film to a level to replace glass with the hard coating film, andin order to improve hardness of the hard coating film, a thickness ofthe hard coating layer basically needs to be increased by apredetermined thickness or more, for example, 50 μm, 70 μm, or 100 μm ormore. However, when the thickness of the hard coating layer isincreased, a curl phenomenon by a hardening contraction is increased, sothat bonding force is decreased and development of the hard coating filmis easily generated. Accordingly, a process of planarizing the supportsubstrate may be additionally performed, but the hard coating layer hasa crack during the planarization process, so that the process ofplanarizing the support substrate is not preferable.

Even though the hard coating composition according to the presentapplication is applied onto the support substrate with a high thicknessand is photocured in order to form a hard coating layer with highhardness, the hard coating composition may form the hard coating layerhaving minimal generation of a curl or a crack and having hightransparency and high hardness. For example, it is possible to form ahard coating layer having a thickness of about 50 μm or more, forexample, about 50 to about 150 μm or a thickness of about 70 to about100 μm, by using the hard coating composition of the presentapplication.

When a hard coating layer is formed by using the hard coatingcomposition of the present application, the hard coating layer may beformed by a typical method used in the art to which the presentinvention belongs.

For example, first, the hard coating composition according to thepresent application is applied onto one surface of a support substrate.In this case, a method of applying the composition is not particularlylimited when the method is usable in the art to which the presentinvention belongs, and for example, a bar coating method, a knifecoating method, a roll coating method, a blade coating method, a diecoating method, a microgravure coating method, a comma coating method, aslot die coating method, a lip coating method, or a solution coatingmethod may be used.

After the hard coating composition is applied, an operation ofstabilizing the surface on which the hard coating composition is appliedmay be selectively performed. The stabilization operation may beperformed, for example, by processing the support substrate on which thehard coating composition is applied at a predetermined temperature.Accordingly, the surface on which the hard coating composition isapplied is planarized and volatile ingredients included in the hardcoating composition are volatilized, thereby further stabilizing thesurface on which the hard coating composition is applied.

Next, a hard coating layer may be formed by photocuring the applied hardcoating composition by radiating ultraviolet rays to the applied hardcoating composition.

When the hard coating layer is formed on both surfaces of the supportsubstrate by using the hard coating composition of the presentapplication, the hard coating layer may be formed by a two stage processin which a first hard coating composition is firstly applied onto onesurface of the support substrate and is firstly photocured, and then asecond hard coating composition is secondly applied onto the othersurface, that is, a rear surface, of the support substrate and issecondly photocured.

In the secondary photocuring operation, the ultraviolet rays areradiated to the side opposite to the side on which the first hardcoating composition is applied, so that a curl generated by hardeningand contraction in the first photocuring operation is offset in anopposite direction to obtain a flat hard coating film. Accordingly, anadditional planarization process is not necessary.

When a film including the hard coating layer formed by using the hardcoating composition of the present application is exposed to atemperature of 50° C. or higher and humidity of 80% or more for 70 hoursor more and then is positioned on a plane, a maximum value of a distancefrom each corner or one side of the film to the plane may be about 1.0mm or less, about 0.6 mm or less, or about 0.3 mm or less. Moreparticularly, when the film including the hard coating layer formed byusing the hard coating composition of the present application is exposedto a temperature of 50 to 90° C. and humidity of 80 to 90% for 70 to 100hours and then is positioned on a plane, a maximum value of a distancefrom each corner or one side of the film to the plane may be about 1.0mm or less, about 0.6 mm or less, or about 0.3 mm or less.

The film including the hard coating layer formed by using the hardcoating composition of the present application exhibits excellent hardhardness, scratch resistance, high transparency, durability, lightresistance, and optical transmittance, thereby being usefully used invarious fields.

For example, the film including the hard coating layer formed by usingthe hard coating composition of the present application may have pencilhardness of 7H or more, 8H or more, or 9H or more at weight of 1 kg.

In the present application, the high hardness hard coating layer may beprovided on any one surface of the substrate, and may also be providedon both surfaces of the substrate.

In the present application, each of the conductive patterns of thedriving electrode unit, the sensing electrode unit, and the wiringelectrode unit may independently include a pattern formed of aconductive metal line. The pattern formed of the conductive metal linemay include a closed curve formed of a straight line, a curved line, orthe straight line and the curved line.

The conductive patterns of the driving electrode unit and the sensingelectrode unit may also be independently regular patterns, and may alsobe irregular patterns.

As the regular pattern, a pattern shape, such as a mesh pattern, knownin the art may be used. The mesh pattern may include a regular polygonalpattern including one or more shapes of a triangle, a quadrangle, apentagon, a hexagon, and an octagon.

In the present application, the conductive patterns of the drivingelectrode unit and the sensing electrode unit are regular patterns andinclude crossing points formed by crossing a plurality of predeterminedlines among the lines forming the patterns, and in this case, the numberof crossing points may be 3,000 to 122,500, may be 13,611 to 30,625, andmay be 19,600 to 30,625 in an area of 3.5 cm×3.5 cm. Further, accordingto the present application, it was confirmed that in the case where thenumber of crossing points is 4,000 to 123,000 when the hard coatinglayer is provided in a display, the hard coating layer exhibits a lightcharacteristic that the optical characteristic of the display is notlargely spoiled.

Further, according to the present application, the conductive patternsof the driving electrode unit and the sensing electrode unit areirregular patterns and include crossing points formed by crossing aplurality of predetermined lines among the lines forming the patterns,and in this case, the number of crossing points may be 6,000 to 245,000,may be 3,000 to 122,500, may be 13,611 to 30,625, and may be 19,600 to30,625 in an area of 3.5 cm×3.5 cm. Further, according to the presentapplication, it was confirmed that in the case where the number ofcrossing points is 4,000 to 123,000 when the hard coating layer isprovided in a display, the hard coating layer exhibits a lightcharacteristic that the optical characteristic of the display is notlargely spoiled.

Pitches of the conductive patterns of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit may be 600 μm orless and may be 250 μm or less, but the pitch may be adjusted accordingto transmittance and conductivity required by the person with ordinaryskill in the art.

A material having specific resistance of 1×10⁶ ohm·cm to 30×10⁶ ohm·cmis appropriate as the material of the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit used in the present application, and a material having specificresistance of 7×10⁶ ohm·cm or less is more preferable.

In the present application, the conductive patterns of the drivingelectrode unit and the sensing electrode unit may be irregular patterns.

The irregular pattern includes a border structure of continuouslyconnected closed figures, the closed figures having the same shape arenot present in a predetermined irregular unit area (1 cm×1 cm), and thenumber of vertices of the closed figures may be different from thenumber of vertices of the quadrangles having the same number as that ofthe closed figures. More particularly, the number of vertices of theclosed figures may be greater than the number of vertices of quadrangleshaving the same number as the number of the closed figures, and may begreater by 1.9 times to 2.1 times of the number of vertices ofquadrangles having the same number as the number of the closed figures,but is not limited thereto.

The closed figures are continuously connected with one another, and forexample, in the case where the closed figures are polygons, the adjacentclosed figures may have a form sharing at least one side.

The irregular pattern includes the border structure of continuouslyconnected closed figures, the closed figures having the same shape arenot present in a predetermined unit area (1 cm×1 cm) in the irregularpattern, and the number of vertices of the closed figures may bedifferent from the number of vertices of the polygon formed byconnecting shortest distances between centers of gravity of the closedfigures. More particularly, the number of vertices of the closed figuresmay be greater than the number of vertices of a polygon formed byconnecting the shortest distance between centers of gravity of theclosed figures, and may be greater by 1.9 times to 2.1 times of thenumber of vertices of a polygon formed by connecting the shortestdistance between centers of gravity of the closed figures, but is notlimited thereto.

The irregular pattern includes the border structure of the continuouslyconnected closed figures, the closed figures having the same shape arenot present in the predetermined unit area (1 cm×1 cm) in the irregularpattern, and in the closed figures, a value of Equation 1 below may be50 or more.(Standard deviation of distances between vertices/average of distancesbetween vertices)×100  [Equation 1]

The value of Equation 1 may be calculated within the unit area of theconductive pattern. The unit area may be an area in which the conductivepattern is formed, and, for example, may be an area of 3.5 cm×3.5 cm andthe like, but is not limited thereto.

In the present application, it is defined that the vertex means a pointat which the lines forming the borders of the closed figures of theconductive pattern cross each other.

The irregular pattern may have a form of the border structure of theclosed figures obtained by disposing predetermined points in regularlyarranged unit cells and then connecting the points to the closest pointsthereto as compared to the distances from other points.

In this case, when irregularity is introduced into a manner wherepredetermined points are disposed in the regularly arranged unit cells,the irregular pattern may be formed. For example, in the case whereirregularity is provided as 0, when the unit cell is a square, theconductive pattern has a square mesh structure, and when the unit cellis a regular hexagon, the conductive pattern has a honeycomb structure.That is, the irregular pattern means a pattern of which irregularity isnot 0.

By the conductive pattern having the irregular pattern shape accordingto the present application, it is possible to suppress a tippingphenomenon and the like of the line forming the pattern, obtain uniformtransmittance from a display, maintain a line density with respect to aunit area at the same level, and secure uniform conductivity.

In the present application, the materials of the conductive patterns ofthe driving electrode unit, the sensing electrode unit, and the wiringelectrode unit are not particularly limited, but may include one or morekinds selected from the group consisting of a metal, a metal oxide, ametal nitride, a metal oxynitride, and a metal alloy. A material whichhas excellent conductivity and is easily etched is preferable as thematerials of the conductive patterns of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit.

In the present application, even though the material having the totalreflectance of 70 to 80% or more is used, it is possible to decrease thetotal reflectance, decrease visibility of the conductive pattern, andmaintain or improve a contrast property.

Particular examples of the material of the conductive patterns of thedriving electrode unit, the sensing electrode unit, and the wiringelectrode unit may include a single film or a multilayered filmincluding gold, silver, aluminum, copper, neodymium, molybdenum, nickel,or an alloy thereof. Herein, the thicknesses of the conductive patternsof the driving electrode unit, the sensing electrode unit, and thewiring electrode unit are not particularly limited, but the thickness of0.01 to 10 μm is preferable in terms of the conductivity of theconductive pattern and the economic efficiency of the forming processthereof.

In the present application, line widths of the conductive patterns ofthe driving electrode unit and the sensing electrode unit may be 10 μmor less, may be 7 μm or less, may be 5 μm or less, may be 4 μm or less,may be 2 μm or less, or may be 0.1 μm or more. More particularly, theline widths of the conductive patterns of the driving electrode unit andthe sensing electrode unit may be 0.1 to 1 μm, 1 to 2 μm, 2 to 4 μm, 4to 5 μm, 5 to 7 μm, or the like, but is not limited thereto.

Further, the line widths of the conductive patterns of the drivingelectrode unit and the sensing electrode unit may be 10 μm or less andthe thickness thereof may be 10 μm or less, the line widths of theconductive patterns of the driving electrode unit and the sensingelectrode unit may be 7 μm or less and the thickness thereof may be 1 μmor less, or the line widths of the conductive patterns of the drivingelectrode unit and the sensing electrode unit may be 5 μm or less andthe thickness thereof may be 0.5 μm or less.

More particularly, in the present application, the line widths of theconductive patterns of the driving electrode unit and the sensingelectrode unit may be 10 μm or less, and in the conductive patterns ofthe driving electrode unit and the sensing electrode unit, the number ofvertexes of the closed figures within the area of 3.5 cm×3.5 cm may be6,000 to 245,000. Further, the line widths of the conductive patterns ofthe driving electrode unit and the sensing electrode unit may be 7 μm orless, and in the conductive patterns, the number of vertices of closedfigures may be from 7,000 to 62,000 in an area of 3.5 cm×3.5 cm.Further, the line widths of the conductive patterns of the drivingelectrode unit and the sensing electrode unit may be 5 μm or less, andin the conductive patterns of the driving electrode unit and the sensingelectrode unit, the number of vertices of closed figures may be from15,000 to 62,000 in an area of 3.5 cm×3.5 cm.

Opening ratios of the conductive patterns of the driving electrode unit,the sensing electrode unit, and the wiring electrode unit, that is, aratio of an area which is not covered by the pattern, may be 70% ormore, 85% or more, and 95% or more. Further, the opening ratios of theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit may be 90 to 99.9%, but is notlimited thereto.

Further, a predetermined area of 1 mm×1 mm of the conductive patterns ofthe driving electrode unit, the sensing electrode unit, and the wiringelectrode unit includes one or more regions, in which opening ratios ofthe conductive patterns of the driving electrode unit, the sensingelectrode unit, and the wiring electrode unit are different from oneanother, and a difference in the opening ratio may be 0.1 to 5%, but isnot limited thereto.

Further, a line width of the conductive pattern of the wiring electrodeunit may be 150 μm or less, may be 100 μm or less, may be 50 μm or less,may be 30 μm or less, may be 10 μm or less, and may be 0.1 μm or more,but is not limited thereto.

In the present application, at least a part of the conductive pattern ofthe wiring electrode unit may have a different line width from those ofthe driving electrode unit and the sensing electrode unit. In this case,a difference in the line width may be 5 to 100 μm, may be 5 to 30 μm,and may be 5 to 15 μm, but is not limited thereto.

In the present application, a printing method is used for forming theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit, thereby forming the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit, which have the small line widths and areprecise, on the transparent substrate. The printing method may beperformed by using a method, in which a paste or ink including aconductive pattern material is transferred on the transparent substratein a desired pattern shape and then is sintered. The printing method isnot particularly limited, and a printing method such as offset printing,screen printing, gravure printing, flexo printing, inkjet printing, andnano imprint may be used, and one or more complex methods among themethods may be used. The printing method may adopt a roll to rollmethod, a roll to plate method, a plate to roll method, or a plate toplate method.

In the present application, a reverse offset printing method may beapplied in order to implement the precise conductive pattern. To thisend, in the present application, a method, in which ink that may serveas a resist during etching is applied onto an entire surface ofsilicon-based rubber that is called a blanket, an unnecessary portion isremoved by using an intaglio on which a pattern called a primary clichéis formed, a printing pattern left on the blanket is secondlytransferred on a film or a substrate, such as glass, on which metal andthe like are deposited, and a desired pattern is formed throughsintering and etching processes, may be performed. In the case where theaforementioned method is used, there is an advantage in that resistancein a thickness direction may be uniformly maintained because thesubstrate, on which metal is deposited, is used and thus uniformity ofline heights is ensured over the entire region. In addition to this, thepresent application may include a direct printing method, in whichconductive ink, such as Ag ink, is directly printed by using theaforementioned reverse offset printing method and then is sintered toform a desired pattern. In this case, the line heights of the patternmay be made uniform by printing pressure, and conductivity may beprovided by a heat sintering process for the purpose of connecting Agnanoparticles due to inter-surface fusion, a microwave sinteringprocess/a laser partial sintering process, or the like.

Particularly, when the conductive pattern of the wiring electrode unitis formed by the printing process, in order to implement a more preciseconductive pattern, the printing may be performed in a directionvertical to a longitudinal direction of the conductive pattern of thewiring electrode unit during the printing process, but the presentapplication is not limited thereto. That is, according to the exemplaryembodiment of the present application, there is a characteristic that inorder to secure dimensional stability of an FPCB bonding region, aprinting direction may be set so that an FPCB bonding pad is disposed ina direction, in which the film is easily contracted and expanded.Contents of the printing direction of the wiring electrode unit areschematically illustrated in FIG. 28.

In the present application, each of the conductive patterns of thedriving electrode unit, the sensing electrode unit, and the wiringelectrode unit may independently additionally include a darkeningpattern provided in the region corresponding to each of the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit.

In the present application, a reflection type diffraction intensity of areflection type diffraction image obtained by radiating light emittedfrom a point light source on one surface from which the darkeningpattern of the touch sensing region is visible may be reduced by 60% ormore as compared to the touch sensor having the same configurationexcept that the conductive pattern is formed of Al and does not includethe darkening pattern. Herein, the reflection type diffraction intensitymay be reduced by 60% or more, 70% or more, and 80% or more as comparedto the touch sensor having the same configuration except that theconductive pattern is formed of Al and does not include the darkeningpattern. For example, the reflection type diffraction intensity may bereduced by 60 to 70%, 70 to 80%, and 80 to 85%.

In the present application, total reflectance measured by using a totalreflectance measuring device with an assumption of ambient light on onesurface from which the darkening pattern of the touch sensing region isvisible may be reduced by 20% or more as compared to the touch sensorhaving the same configuration except that the conductive pattern isformed of Al and does not include the darkening pattern. Herein, thetotal reflectance may be reduced by 20% or more, 25% or more, and 30% ormore as compared to the touch sensor having the same configurationexcept that the conductive pattern is formed of Al and does not includethe darkening pattern. For example, the total reflectance may be reducedby 25 to 50%.

In the present application, the darkening pattern of the touch sensingregion may be provided on upper surfaces and/or lower surfaces of theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit, and may be provided on at leastparts of the lateral surfaces of the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit, as well as the upper surfaces and the lower surfaces of theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit, and may be provided the entireupper surfaces, lower surfaces, and lateral surfaces of the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit.

In the present application, the darkening pattern of the touch sensingregion is provided on the entire surfaces of the conductive patterns ofthe driving electrode unit, the sensing electrode unit, and the wiringelectrode unit, so that it is possible to decrease visibility of theconductive patterns according to high reflectance of the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit. In this case, when the darkening pattern isbonded to a layer having high reflectance, such as the conductive layer,since the darkening pattern has destructive interference and self-lightabsorbance under a specific thickness condition, the quantity of lightreflected by the darkening pattern is adjusted to be similar to thequantity of light reflected by the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit through the darkening pattern, and simultaneously, mutualdestructive interference between two lights is guided under the specificthickness condition, thereby exhibiting an effect of reducing thereflectance by the conductive patterns of the driving electrode unit,the sensing electrode unit, and the wiring electrode unit.

In this case, in a color range of a pattern region formed of thedarkening pattern and the conductive pattern, which is measured from thesurface from which the darkening pattern of the touch sensing regionaccording to the present application is visible, a value of L may be 20or less, a value of A may be −10 to 10, and a value of B may be −70 to70, a value of L may be 10 or less, a value of A may be −5 to 5, and avalue of B may be 0 to 35, and a value of L may be 5 or less, a value ofA may be −2 to 2, and a value of B may be 0 to 15 based on a CIE LABcolor coordinate.

Further, the total reflectance of the pattern region formed of thedarkening pattern and the conductive patterns of the driving electrodeunit, the sensing electrode unit, and the wiring electrode unit which ismeasured from the surface from which the darkening pattern of the touchsensing region according to the present application is visible, may be17% or less, 10% or less, or 5% or less based on external light of 550nm.

Herein, the total reflectance means reflectance obtained inconsideration of both diffuse reflectance and specular reflectance. Thetotal reflectance is a value observed by setting the reflectance of anopposite surface of the surface of which reflectance is desired to bemeasured by using a black paste, a tape or the like to 0 and thenmeasuring only the reflectance of the surface to be measured, and inthis case, a diffuse light source that is most similar to the ambientlight condition is introduced as the provided light source. Further, inthis case, the measurement position of the reflectance is set based on aposition that is inclined at about 7° from a vertical line of ahemisphere of an integrating sphere.

In the present application, the darkening pattern and the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit may be patterned simultaneously or separately,but layers for forming the respective patterns are separately formed.However, it is most preferable to form the conductive pattern and thedarkening pattern at the same time in order to allow the conductivepattern and the darkening pattern to be present on the preciselycorresponding surfaces.

By forming the pattern as described above, it is possible to implement afine conductive pattern required in a touch screen while optimizing andmaximizing an effect of the darkening pattern itself. In the touchsensor, when the fine conductive pattern fails to be implemented, theproperty, such as resistance, required for the touch sensor, may not beachieved.

In the present application, since in the darkening pattern and theconductive patterns of the driving electrode unit, the sensing electrodeunit, and the wiring electrode unit form, a separate pattern layer formsa laminate structure, the structure is different from a structure inwhich at least a portion of a light absorption material is recessed ordispersed in a conductive pattern, or a structure in which a part of asurface is physically or chemically modified by performing a surfacetreatment on a conductive layer of a single layer.

Further, in the touch sensor according to the present application, thedarkening pattern is directly provided on the substrate or is directlyprovided on the conductive patterns of the driving electrode unit, thesensing electrode unit, and the wiring electrode unit without aninterposed attachment layer or adhesive layer. The attachment layer oradhesive layer may affect durability or optical properties. In addition,a method of manufacturing the laminate included in the touch sensoraccording to the present application is totally different from a methodin the case where the attachment layer or adhesive layer is used.Further, in the present application, an interference characteristic ofthe substrate or the conductive patterns of the driving electrode unit,the sensing electrode unit, and the wiring electrode unit and thedarkening pattern is excellent compared to that of the case where theattachment layer or adhesive layer is used.

In the present application, when the darkening pattern has a destructiveinterference characteristic and an absorption coefficient characteristicthat are the aforementioned physical properties, and when it is definedthat the wavelength of light is λ, and the refractive index of thedarkening pattern is n, as long as the thickness of the darkeningpattern satisfies the thickness condition of λ/(4×n)=N (herein, N is anodd number), any thickness of the darkening pattern may be used.However, during the manufacturing process, in consideration of anetching property with the conductive pattern, it is preferable that thethickness is selected from 10 nm to 400 nm, but the preferable thicknessmay be different according to the used material and manufacturingprocess, and the scope of the present application is not limited to theforegoing numerical range.

The darkening pattern may also be formed of a single layer, or may alsobe formed of a plurality of layers of two or more layers.

It is preferable that the darkening pattern has a color close to anachromatic color. However, the color does not need to be the achromaticcolor, and as long as the darkening pattern has low reflectance eventhough the darkening pattern has a color, the darkening pattern may beadopted. In this case, the achromatic color means a color exhibited whenlight that is incident to a surface of an object is not selectivelyabsorbed but is evenly reflected and absorbed with respect to awavelength of each component. In the present application, the darkeningpattern may use a material having a standard deviation of totalreflectance for each wavelength range of 50% or less in a visible rayregion (400 nm to 800 nm) when the total reflectance is measured.

The material of the darkening pattern is a light absorbing material, andpreferably, as long as a material is made of a metal, a metal oxide, ametal nitride, or a metal oxynitride having the aforementioned physicalproperties when the entire layer is formed, the material may be usedwithout a particular limitation.

For example, the darkening pattern may be an oxide film, a nitride film,an oxide-nitride film, a carbide film, a metal film, or a combinationthereof formed by using Ni, Mo, Ti, Cr, and the like under a depositioncondition set by those skilled in the art.

As a particular example, the darkening pattern may include both Ni andMo. The darkening pattern may further include 50 to 98 atom % of Ni and2 to 50 atom % of Mo, and may further include 0.01 to 10 atom % of othermetals, for example, such as Fe, Ta, and Ti. Herein, the darkeningpattern, if necessary, may further include 0.01 to 30 atom % of nitrogenor 4 atom % or less of oxygen and carbon.

As another particular example, the darkening pattern may include adielectric material selected from SiO, SiO₂, MgF₂, and SiNx (x is aninteger of 1 or more) and a metal selected from Fe, Co, Ti, V, Al, Cu,Au, and Ag, and may further include an alloy of two or more kinds ofmetals selected from Fe, Co, Ti, V, Al, Cu, Au, and Ag. It is preferablethat the dielectric material is distributed in an amount graduallydecreased as external light goes away from an incident direction, andthe metal and alloy components are distributed on the contrary. In thiscase, it is preferable that the content of the dielectric material is 20to 50 wt % and the content of the metal is 50 wt % to 80 wt %. In thecase where the darkening pattern further includes the alloy, it ispreferable that the darkening pattern includes 10 to 30 wt % of thedielectric material, 50 to 80 wt % of the metal, and 5 to 40 wt % of thealloy.

As another particular example, the darkening pattern may be formed of athin film including one or more of an alloy of nickel and vanadium, andan oxide, a nitride, and an oxynitride of nickel and vanadium. In thiscase, it is preferable that vanadium is contained in a content of 26atom % to 52 atom %, and it is preferable that an atomic ratio ofvanadium to nickel is 26/74 to 52/48.

As another particular example, the darkening pattern may include atransition layer in which two or more elements are included and acomposition ratio of one element is increased by a maximum of about 20%per 100 angstrom according to an incident direction of external light.In this case, one element may be a metal element, such as chrome,tungsten, tantalum, titanium, iron, nickel or molybdenum, and an elementother than the metal element may be oxygen, nitrogen or carbon.

As another particular example, the darkening pattern may include a firstchrome oxide layer, a metal layer, a second chrome oxide layer, and achrome mirror, and in this case, the darkening pattern may include ametal selected from tungsten, vanadium, iron, chrome, molybdenum, andniobium instead of chrome. The metal layer may have a thickness of 10 to30 nm, the first chrome oxide layer may have a thickness of 35 to 41 nm,and the second chrome oxide layer may have a thickness of 37 to 42 nm.

As another particular example, a laminate structure of an alumina(Al₂O₃) layer, a chrome oxide (Cr₂O₃) layer, and a chrome (Cr) layer maybe used as the darkening pattern. Herein, the alumina layer hasimprovement of a reflection characteristic and a light diffusionprevention characteristic, and the chrome oxide layer may improve acontrast characteristic by decreasing mirror surface reflectance.

In the present application, the darkening pattern is provided in theregions corresponding to the conductive patterns of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit. Herein, the region corresponding to the conductive pattern meansthe region having the pattern having the same shape as that of theconductive pattern. However, a pattern scale of the darkening patterndoes not need to be completely the same as that of the conductivepattern, and the case where a line width of the darkening pattern issmaller or larger than the line width of the conductive pattern is alsoincluded in the scope of the present application. For example, it ispreferable that the darkening pattern has an area of 80 to 120% of anarea in which the conductive pattern is provided.

The darkening pattern may have a pattern shape having the line widththat is the same as or larger than the line width of the conductivepattern.

When the darkening pattern has a pattern shape having the line widththat is larger than the line width of the conductive pattern, thedarkening pattern may more greatly impart an effect that the darkeningpattern blocks the conductive pattern during the observation by a user,so that there is an advantage in that the darkening pattern mayefficiently block an effect caused by luster or reflection of theconductive pattern itself. However, even when the line width of thedarkening pattern is the same as the line width of the conductivepattern, a target effect of the present application may be achieved. Theline width of the darkening pattern may be larger than the line width ofthe conductive pattern by a value according to Equation 2 below.Tcon×tangent θ₃×2  [Equation 2]In Equation 2, Tcon is a thickness of the conductive pattern, and θ₃ isan angle between light and a normal line with respect to the surface ofthe substrate when the light incident from a position, at which a visionof a user of the touch sensor is positioned, passes through corners ofthe conductive pattern and the darkening pattern.

θ₃ is an angle obtained by changing an angle (θ₁) between the vision ofthe user of the touch sensor and the substrate by a refractive index ofthe substrate and a refractive index of a medium of a region in whichthe darkening pattern and the conductive pattern are disposed, forexample, an adhesive of the touch sensor according to the Snell's law.

For example, when it is assumed that an observer observes the laminateso that the value of θ₃ is about 80° and the thickness of the conductivepattern is about 200 nm, it is preferable that the line width of thedarkening pattern is larger than that of the conductive pattern by about2.24 μm (200 nm×tan(80)×2) based on the lateral surface. However, asdescribed above, even when the darkening pattern has the same line widthas that of the conductive pattern, a target effect of the presentapplication may be implemented.

According to one particular example of the present application, it ispossible to improve a manufacturing process of a touch sensor todecrease manufacturing cost of a touch sensor, and improve lightness andthinness of the touch sensor.

According to the exemplary embodiment of the present application, it ispossible to provide the touch sensor in the single surface one-sheettype, so that it is possible to minimize a thickness of the touchsensor, and all of the conductive patterns are formed on the singlesurface, so that the manufacturing method is easy. Further, the touchsensor is in the one sheet type, so that the present application has anadvantage in that the lamination is not required compared to the relatedart in which the touch sensor is formed by using two or more sheets ofsubstrates. Further, the driving electrode unit and the sensingelectrode unit are present on the same surface, so that it is easy toinstall and attach a flexible printed circuit board (FPCB). Further, thetouch sensor is in the one sheet type, so that light transmittance isexcellent compared to the touch sensor in the two sheet type. Further,when a functional surface film is laminated on the surface of the touchsensor, a step is not large, so that there is an advantage in thatbubbles are not generated.

According to one particular example of the present application, it ispossible to improve a manufacturing process of a touch sensor todecrease manufacturing cost of the touch sensor, and improve lightnessand thinness of the touch sensor.

The invention claimed is:
 1. A touch sensor, comprising: a substrate;and a driving electrode unit, a sensing electrode unit, and a wiringelectrode unit provided on the same surface of the substrate, wherein:the touch sensor includes a touch sensing region and a touch non-sensingregion, each of the driving electrode unit, the sensing electrode unit,and the wiring electrode unit includes a conductive pattern including ashielding portion and an opening portion, the wiring electrode unitincludes a first wiring electrode unit positioned in the touch sensingregion of the touch sensor and a second wiring electrode unit positionedin the touch non-sensing region of the touch sensor, the conductivepattern configuring the touch sensing region includes a form, in which nrepeated unit patterns are repeated in a width direction of the touchsensing region, wherein a width D of the repeat unit pattern isexpressed by Equation 1 below,D=A/(n×m)  [Equation 1] in Equation 1, A is a width of the touch sensingregion, n is the number of repeat unit patterns, and m is a divisor ofn.
 2. A touch sensor, comprising: a substrate; and a driving electrodeunit, a sensing electrode unit, and a wiring electrode unit provided onthe same surface of the substrate, wherein: the touch sensor includes atouch sensing region and a touch non-sensing region, each of the drivingelectrode unit, the sensing electrode unit, and the wiring electrodeunit includes a conductive pattern including a shielding portion and anopening portion, the wiring electrode unit includes a first wiringelectrode unit positioned in the touch sensing region of the touchsensor and a second wiring electrode unit positioned in the touchnon-sensing region of the touch sensor, the conductive patternconfiguring the touch sensing region includes a form, in which nrepeated unit patterns are repeated in a width direction of the touchsensing region, the first wiring electrode unit includes one or two ormore bundles of the wires connecting the driving electrode unit or thesensing electrode unit to the second wiring electrode unit, each of thewires is formed of a mesh pattern, and in the bundle including themaximum number of wires among the bundles, a width (W) of the bundle,the number (n2) of wires included in the bundle, and a minimum value (P)among distances between center points of adjacent mesh structuressharing at least one side among the mesh patterns forming the wiressatisfy Equation 2: $\begin{matrix}{{\frac{W}{n\; 2} \times \sqrt{2}} \geq {P.}} & \lbrack {{Equation}\mspace{14mu} 2} \rbrack\end{matrix}$
 3. The touch sensor of claim 2, wherein the bundle isformed in a pattern shape, in which a closed figure having two firstdisconnection points is continuously disposed in a direction from oneside of the substrate adjacent to an end of the second wiring electrodeto the other side of the substrate facing the one side, a virtualstraight line connecting the adjacent the first disconnection points ofthe continuously disposed closed figures with a shortest distance hasone or more inflection points, an angle formed by the virtual straightline at the inflection point is 90° or more, and a pattern that is incontact with the virtual straight line electrically connects the drivingelectrode unit or the sensing electrode unit to the second wiringelectrode unit.
 4. The touch sensor of claim 2, wherein Equation 2 isexpressed by Equation 3: $\begin{matrix}{\frac{W}{n\; 2} \geq {P \times \cos\;\theta\; 1}} & \lbrack {{Equation}\mspace{14mu} 3} \rbrack\end{matrix}$ wherein: W is a width of the bundle, n2 is the number ofwires included in the bundle, P is a minimum value among distancesbetween center points of adjacent mesh structures sharing at least oneside among the mesh patterns forming the wires, and θ1 represents asmall value among the angles between a straight line continuing in awidth direction of the bundle with the shortest distance and straightlines connecting center points of the adjacent mesh structures sharingat least one side with the shortest distance.
 5. The touch sensor ofclaim 3, wherein Equation 2 is expressed by Equation 4: $\begin{matrix}{\frac{W}{n\; 2} \geq {P \times \cos\;{\theta 2}}} & \lbrack {{Equation}\mspace{14mu} 4} \rbrack\end{matrix}$ wherein: W is a width of the bundle, n2 is the number ofwires included in the bundle, P is a minimum value among distancesbetween center points of adjacent mesh structures sharing at least oneside among the mesh patterns forming the wires, and θ2 represents asmall value among the angles between a straight line in a verticaldirection with respect to a virtual straight line connecting the firstdisconnection points with the shortest distance, and a straight lineconnecting the center points of the adjacent mesh structures sharing atleast one side with the shortest distance.
 6. The touch sensor of claim3, wherein a part, which has the longest distance between the inflectionpoints, in the virtual straight line is parallel to at least one sideconfiguring the closed figure or forms an angle more than 0° and lessthan 90°.
 7. A touch sensor, comprising: a substrate; and a drivingelectrode unit, a sensing electrode unit, and a wiring electrode unitprovided on the same surface of the substrate, wherein: the touch sensorincludes a touch sensing region and a touch non-sensing region, each ofthe driving electrode unit, the sensing electrode unit, and the wiringelectrode unit includes a conductive pattern including a shieldingportion and an opening portion, the wiring electrode unit includes afirst wiring electrode unit positioned in the touch sensing region ofthe touch sensor and a second wiring electrode unit positioned in thetouch non-sensing region of the touch sensor, the conductive patternconfiguring the touch sensing region includes a form, in which nrepeated unit patterns are repeated in a width direction of the touchsensing region, the conductive patterns of the driving electrode unit,the sensing electrode unit, and the wiring electrode unit are formed ofregular polygonal mesh patterns, and the repeat unit pattern satisfiesEquation 5:0<A _(s) +A _(s1)<2A _(L)  [Equation 5] wherein: A_(s) is an area of onefirst polygon which is provided within the repeat unit pattern andincludes any one vertical distal end of the repeat unit pattern, A_(S1)is an area of one second polygon which is provided within the repeatunit pattern and includes another vertical distal end of the repeat unitpattern, and A_(L) is an area of the one regular polygon, and the firstpolygon and the second polygon are provided so as to share the samehorizontal axis of the repeat unit pattern.
 8. The touch sensor of claim7, wherein the repeat unit pattern satisfies Equation 6:0<A _(s) +A _(s1) =A _(L)  [Equation 6] wherein: A_(s) is an area of onefirst polygon which is provided within the repeat unit pattern andincludes any one vertical distal end of the repeat unit pattern, A_(S1)is an area of one second polygon which is provided within the repeatunit pattern and includes another vertical distal end of the repeat unitpattern, and A_(L) is an area of the one regular polygon, and the firstpolygon and the second polygon are provided so as to share the samehorizontal axis of the repeat unit pattern.
 9. The touch sensor of claim1, wherein the conductive pattern is formed of a conductive metal line.10. The touch sensor of claim 9, wherein the conductive metal lineincludes one or more kinds selected from the group consisting of gold,silver, aluminum, copper, neodymium, molybdenum, nickel, and an alloythereof.
 11. The touch sensor of claim 1, wherein each of the conductivepatterns of the driving electrode unit, the sensing electrode unit, andthe wiring electrode unit independently additionally includes adarkening pattern on the conductive pattern.
 12. The touch sensor ofclaim 3, wherein an average diameter of each of the first disconnectionpoints is 13 μm or less.
 13. The touch sensor of claim 3, wherein atleast a part of the conductive patterns of the driving electrode unitand the sensing electrode unit includes a second disconnection point,and an average diameter of the second disconnection point is 13 μm orless.
 14. The touch sensor of claim 13, wherein the driving electrodeunit and the sensing electrode unit are formed of conductive metallines, and the second disconnection point is provided in a crossingpoint region, in which the conductive metal lines within the drivingelectrode unit or the sensing electrode unit cross each other.
 15. Thetouch sensor of claim 1, wherein each of the conductive patterns of thedriving electrode unit, the sensing electrode unit, and the wiringelectrode unit independently includes a polygonal mesh pattern.
 16. Thetouch sensor of claim 1, wherein a width of the bundle is “W”, and basedon an area of W×W, an opening ratio deviation between predeterminedregions of the touch sensor corresponding to the area of W×W is within10%.
 17. The touch sensor of claim 1, wherein the driving electrodeunit, the sensing electrode unit, and the wiring electrode unit aresimultaneously formed by a one-time printing process.
 18. The touchsensor of claim 1, wherein the touch sensor recognizes a touch input byusing a mutual capacitance method.
 19. A display apparatus comprisingthe touch sensor of claim 1.